Modeling and characterization of PCB coils for inductive wireless charging

Curran Brian; Maaß Uwe; Fotheringham Gerhard; Stevens Nobby; Ndip Ivan; Lang Klaus-Dieter; Curran Brian; Maaß Uwe; Fotheringham Gerhard; Stevens Nobby; Ndip Ivan; Lang Klaus-Dieter

doi:10.1017/wpt.2015.14

2015 Volume 2

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Modeling and characterization of PCB coils for inductive wireless charging

1.
TU Berlin, Straße des 17, Juni 135, 10623 Berlin, Germany. Phone: +4903046403757
2.
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer Allee 25, 13355, Berlin
3.
Katholieke Universiteit Leuven, Oude Markt 13, 3000 Leuven, Belgien

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Author Bio:
Brian Curran received his B.S. in electrical engineering from the University of Rochester, New York, his M.S. from the University of Kassel, Germany and his doctor of engineering from the Technical University of Berlin. He has worked at the Fraunhofer Institute for Reliability and Microintegration since 2008. His research includes signal and power integrity, antenna design and integration and electromagnetic compatibility
Corresponding author: B. Curran Email: brian.curran@izm.fraunhofer.de

Wireless Power Transfer 2015, 2(2): 127-133 | Cite this article

Abstract

Wireless charging is emerging as a viable technology in many industries, including consumer, medical, and sensor electronics. An investigation of design principles is conducted for a wireless charging platform that is designed to charge devices of different sizes and technologies, using only through vias. It is shown that at a 5 mm separation distance, a coupling coefficient can be achieved which varies from 0.12 to 0.37 when staggered hexagonal transmitter coils (approximately 5 cm across) are used with an unstaggered square receiver coil, which declines to 0.06–0.11 at 2 cm separation. Without design measures, the coupling coefficient will approach zero at certain positions. The quality factors of the coils can be improved by stacking the coils in parallel, enabling the use of only through-vias, while the inductance can be controlled horizontally by increasing the number of turns in the inductor.
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Curran B, Maaß U, Fotheringham G, Stevens N, Ndip I, et al. 2015. Modeling and characterization of PCB coils for inductive wireless charging. Wireless Power Transfer 2(2): 127–133 doi: 10.1017/wpt.2015.14

Curran B, Maaß U, Fotheringham G, Stevens N, Ndip I, et al. 2015. Modeling and characterization of PCB coils for inductive wireless charging. Wireless Power Transfer 2(2): 127–133 doi: 10.1017/wpt.2015.14

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Modeling and characterization of PCB coils for inductive wireless charging

1.
TU Berlin, Straße des 17, Juni 135, 10623 Berlin, Germany. Phone: +4903046403757
2.
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer Allee 25, 13355, Berlin
3.
Katholieke Universiteit Leuven, Oude Markt 13, 3000 Leuven, Belgien

Author Bio:
Brian Curran received his B.S. in electrical engineering from the University of Rochester, New York, his M.S. from the University of Kassel, Germany and his doctor of engineering from the Technical University of Berlin. He has worked at the Fraunhofer Institute for Reliability and Microintegration since 2008. His research includes signal and power integrity, antenna design and integration and electromagnetic compatibility
Corresponding author: B. Curran Email: brian.curran@izm.fraunhofer.de

Wireless Power Transfer 2, Article number: 10.1017/wpt.2015.14 (2015) | Cite this article

Abstract: Wireless charging is emerging as a viable technology in many industries, including consumer, medical, and sensor electronics. An investigation of design principles is conducted for a wireless charging platform that is designed to charge devices of different sizes and technologies, using only through vias. It is shown that at a 5 mm separation distance, a coupling coefficient can be achieved which varies from 0.12 to 0.37 when staggered hexagonal transmitter coils (approximately 5 cm across) are used with an unstaggered square receiver coil, which declines to 0.06–0.11 at 2 cm separation. Without design measures, the coupling coefficient will approach zero at certain positions. The quality factors of the coils can be improved by stacking the coils in parallel, enabling the use of only through-vias, while the inductance can be controlled horizontally by increasing the number of turns in the inductor.

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